Daicel Celloxide 2021 CAS 2386-87-0

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CAS:2386-87-0

Molecular Formula:C14H20O4

Molecular Weight:252.31

EINECS:219-207-4

Alicyclic epoxy resin 3, 4-epoxy-cyclohexyl methyl 3, 4-epoxy-cyclohexyl formate overcomes the disadvantages of traditional bisphenol A epoxy resin, such as poor weather resistance, high temperature resistance and poor impact resistance, and has been paid high attention to in all walks of life. At present, due to raw materials and process restrictions, only small batch production, there is no large-scale production of industrial equipment.

Item	Specification
Melting point	−37 °C
Boiling point	355.49°C
Density	1.17 g/mL at 25 °C
Vapor pressure	0.002Pa at 25℃
Refractive index	n20/D 1.498
Flash point	245 °F
LogP	1.34 at 20℃
Acidity coefficient (pKa)	4.61±0.20